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Friday, February 24th, 2012Photonic wire bonding
Thursday, November 17th, 2011Karlsruhe Institute of Technology has demonstrated photonic wire bonding between two SOI chips. They have demonstrated an aggregate data transmission rate of 5.25 Tbit/s over one photonic wire. Assuming a linear wire bond pitch of 5 microns, they conclude that a transmission rate of 1 Pbit/s/mm from a chip is within reach.
The photonic wire bonds are manufactured by two-photon lithography in SU-8 resist. One can easily envision taking this technology into manufacturing. It should enable very high speed chip-chip communication.
For details, see arXiv:1111.0651v1.