Prof. Moritz at the University of Massachusetts, Amherst, posted a preprint last week with a rather detailed architecture for building integrated circuits around (vertical) nanowire fabrics. The team has addressed circuitry, connectivity, heat removal, and manufacturability. It is an exciting proposal, which might yet extend Moore’s law.
That said, the manufacturing flow looks very different from anything we’ve seen to date. Hopefully the team will turn to this point next, and demonstrate working devices and circuits.
Reference: M Rahman, S Khasanvis, J Shi, M Li, and C A Moritz, “Skybridge: 3-D Integrated Circuit Technology” [arXiv:1404.0607]